Glass Wafer Dicing Improves Yield and Achieves Die Aspect Ratios Unheard of in the Electronics Industry

 A new process that processes glass wafers with a diameter of 300mm can significantly improve yield. It can also achieve die aspect ratios that are unheard of in the semiconductor industry. 300mm Glass wafer dicing technology was originally developed for micro-optics and micro-micro-fluidics but is now being applied to brittle, glass-based semiconductor applications. Read on to find out more.

Scribing

The production of semiconductors requires precision and accuracy when scribing glass wafers. To ensure the high quality and consistency of the finished products, Corning uses a fully automatic scribing system with pattern recognition systems that find the proper position for the scribe, brake, and other components. The final step involves edge grinding. After the scribe, the glass package is turned over a few times.

The scribing process involves rolling a small diamond wheel over the glass surface. The scribe line creates a shallow "vent" on the surface. This scribe can be shallow or deep and will determine the strength, edge quality, and cleanliness of the finished product. The scribe line thickness depends on the blade quality, scribe-wheel angle, and cutting pressure. The cutting speed should be between 20 and 25 mm/sec to achieve maximum accuracy.

Laser full cut dicing

The process of laser-full cut dicing of a 300-mm glass wafer requires a high-quality, crystalline glass wafer and the laser beam. This process is considerably more expensive than other cutting methods. However, it is advantageous in some situations. In such cases, a hybrid laser scribing and plasma etching approach may be used to perform the dicing.

The technique is a highly specialized process, allowing for the precise cutting of squares, rectangles and straight lines on the glass wafer. Several factors are important to get precise results, such as blade diameter and thickness. The precision of dicing can be increased if multiple variables are controlled simultaneously. The laser dicing process can produce perfect squares and rectangles, and the process can be performed in a shorter time.

Diamond blade dicing

The bond hardness of a diamond blade is a very important factor in the success of dicing. This characteristic affects the durability and performance of the blade. In general, the harder the bond hardness, the longer the blade can stay sharp. Therefore, diamond blades with higher bond hardness are recommended for hard and softer materials. In addition to hardness, bond hardness also plays a major role in the life span of a diamond blade.

The number of diamonds per carat and the amount of material that is cut is two important considerations for dicing. The lower the mesh size, the larger the diamond crystals and the higher the diamond density. As a general rule, a 30/40 Mesh black diamond has 660 crystals per carat, while a 40/50 Mesh black diamond has around 1,700 crystals per carat. To ensure maximum diamond life and minimize power consumption, consider the number of cutting points produced.

Laser dicing

A laser is a powerful tool for semiconductor and electronics manufacturers. The high-power pulses used in laser dicing reduce the thickness of the silicon substrate. Laser dicing can be done at a high speed. However, it can be difficult to perform at a low speed. However, there are many advantages to using this technology. Here are a few of them:

Stealth dicing uses a semi-transparent wavelength of light to cut the wafer. It targets the midpoint of the wafer and makes a small crack. It does not reach the surface and does not cause any damage to the glass. It is important to choose the right starting point in order to get a perfect result. This process is ideal for removing micro-cracks from the edge of the wafer, improving its fracture strength.

Traditional blade dicing

A blade dicing saw is a common method for cutting wafers and is most commonly used for singulating or fracturing thin chips. However, these saws can be used for processing-thick substrates, such as silicon. DISCO's innovative solutions take advantage of its manufacturing technology, including its own equipment and consumables. For example, it has demonstrated a 60 mm deep grooving into a soda-lime glass block using a blade dicing saw. It also demonstrated a 49-mm-deep grooving in a ceramic block using a blade dicing saw.

Dicing processes are automated and require different dicing blade thickness. Aside from cutting, dicing may involve wax mounting and scribing. In addition, dicing services may include wafer inspection and die sorting. The final product can be packaged in a taped hoop, waffle pack, or gel-pak. To get a quote for dicing services, contact the Dicing Services team today.