Glass Wafer Dicing Improves Yield and Achieves Die Aspect Ratios Unheard of in the Electronics Industry
A new process that processes glass wafers with a diameter of 300mm can significantly improve yield. It can also achieve die aspect ratios that are unheard of in the semiconductor industry. 300mm Glass wafer dicing technology was originally developed for micro-optics and micro-micro-fluidics but is now being applied to brittle, glass-based semiconductor applications. Read on to find out more. Scribing The production of semiconductors requires precision and accuracy when scribing glass wafers. To ensure the high quality and consistency of the finished products, Corning uses a fully automatic scribing system with pattern recognition systems that find the proper position for the scribe, brake, and other components. The final step involves edge grinding. After the scribe, the glass package is turned over a few times. The scribing process involves rolling a small diamond wheel over the glass surface. The scribe line creates a shallow "vent" on the surface. This scribe can